By Chuan Seng Tan,Kuan-Neng Chen,Steven J. Koester
Three-dimensional (3D) integration is pointed out as a potential road for non-stop functionality progress in built-in circuits (IC) because the traditional scaling technique is confronted with unparalleled demanding situations in primary and monetary limits. Wafer point 3D IC can take a number of kinds, they usually often comprise a stack of numerous thinned IC layers which are vertically bonded and interconnected through via silicon through TSV.
There is a protracted string of advantages that you possibly can derive from 3D IC implementation equivalent to shape issue, density multiplication, more desirable hold up and tool, stronger bandwidth, and heterogeneous integration. This publication provides contributions by way of key researchers during this box, overlaying motivations, expertise structures, functions, and different layout concerns.
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